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d a t a sh eet product speci?cation supersedes data of 2001 jul 02 file under integrated circuits, ic02 2001 jul 11 integrated circuits tda9859 universal hi-fi audio processor for tv
2001 jul 11 2 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 features multi-source selector switches six af inputs (three stereo sources or six mono sources) each of the input signals can be switched to each of the outputs (crossbar switch) outputs for loudspeaker channel and peri-tv connector (scart) switchable spatial stereo and pseudo stereo effects audio surround decoder can be added externally two general purpose logic output ports i 2 c-bus control of all functions. general description the tda9859 provides control facilities for the main and the scart channel of a tv set. due to extended switching possibilities, signals from three stereo sources can be handled. quick reference data ordering information symbol parameter min. typ. max. unit v p positive supply voltage (pin v p ) 7.2 8.0 8.8 v i p supply current - 25 - ma v i(rms) input signal levels for 0 db gain (rms value) 2 -- v v o(rms) output signal levels for 0 db gain (rms value) 2 -- v g v voltage gain in main channel volume control (in 1 db steps, balance included) - 63 - +15 db mute - 80 -- db bass control (in 1.5 db steps) - 12 - +15 db treble control (in 3 db steps) - 12 - +12 db thd total harmonic distortion - 0.1 - % s/n signal-to-noise ratio - 85 - db t amb ambient temperature 0 - 70 c type number package name description version tda9859 sdip32 plastic shrink dual in-line package; 32 leads (400 mil) sot232-1 TDA9859H qfp44 plastic quad ?at package; 44 leads (lead length 1.3 mm); body 10 10 1.75 mm sot307-2
2001 jul 11 3 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... block diagram f ull pagewidth l 470 nf 28 (43) r 470 nf 30 (3) l 470 nf 1 (7) r 470 nf 32 (5) l 470 nf 3 (9) r 470 nf 5 (13) multiple source and mode selector (crossbar switch) reference voltage lr v p + 8 v 6 (14) scart output lr scout l scout r 26 (41) 7 (15) 4 (10) c smo 100 m f 8 gnd 24 (38) 9 (18) mout l mout r line output or optional surround sound decoder connection volume control 23 (37) 10 (19) stereo mhb917 spatial stereo pseudo stereo forced mono c ps1 c ps2 29 (2) 27 (42) bass control c br1 c br2 11 (20) 12 (21) 33 nf c bl1 c bl2 22 (36) 21 (35) treble control 5.6 nf c tr 5.6 nf c tl 14 (25) volume balance mute (30) 18 (26) 15 loudspeaker channel outputs l r lout r lout l i 2 c-bus interface mad sda scl i 2 c-bus 19 (31) 25 (40) 17 (29) 16 (27) p2 (4) 31 (17) tda9859 (TDA9859H) 11 (22) 12 (21) 68 nf 0.15 m f 13 k w extended bass control (1) aux scart main 33 nf ain l ain r scin l scin r min l min r lin l lin r audio inputs (1) (1) (16) agnd p1 (8) 2 dgnd fig.1 block diagram and application circuit. the pin numbers given in parenthesis refer to the TDA9859H version. (1) for extended bass control, the capacitor between c br/l1 and c br/l2 should be replaced by the extended bass control network.
2001 jul 11 4 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 pinning symbol pin description tda9859 TDA9859H scin l 1 7 scart input; left channel p1 2 8 port 1 output min l 3 9 main input; left channel c smo 4 10 smoothing capacitor of reference voltage n.c. - 11 not connected n.c. - 12 not connected min r 5 13 main input; right channel v p 6 14 supply voltage scout r 7 15 scart output; right channel gnd 8 - ground agnd - 16 analog ground dgnd - 17 digital ground mout r 9 18 main output; right channel lin r 10 19 input to right loudspeaker channel c br1 11 20 bass capacitor connection 1; right channel c br2 12 21 bass capacitor connection 2; right channel n.c. - 22 not connected n.c. - 23 not connected n.c. 13 24 not connected c tr 14 25 treble capacitor connection; right channel lout r 15 26 loudspeaker output; right channel scl 16 27 serial clock input; i 2 c-bus n.c. - 28 not connected sda 17 29 serial data input/output; i 2 c-bus lout l 18 30 loudspeaker output; left channel c tl 19 31 treble capacitor connection; left channel n.c. 20 32 not connected n.c. - 33 not connected n.c. - 34 not connected c bl2 21 35 bass capacitor connection 2; left channel c bl1 22 36 bass capacitor connection 1; left channel lin l 23 37 input to left loudspeaker channel mout l 24 38 main output; left channel n.c. - 39 not connected mad 25 40 module address select input scout l 26 41 scart output; left channel c ps2 27 42 pseudo stereo capacitor 2 ain l 28 43 aux input; left channel n.c. - 44 not connected n.c. - 1 not connected c ps1 29 2 pseudo stereo capacitor 1 ain r 30 3 aux input; right channel p2 31 4 port 2 output scin r 32 5 scart input signal right n.c. - 6 not connected symbol pin description tda9859 TDA9859H
2001 jul 11 5 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 handbook, halfpage tda9859 mha779 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 scin r scin l p2 p1 ain r min l c ps1 c smo ain l min r c ps2 scout l v p mad mout l scout r lin l c bl1 c bl2 n.c. c tl lout l sda gnd mout r lin r c tr c br1 c br2 n.c. lout r scl fig.2 pin configuration tda9859 sdip32 version.
2001 jul 11 6 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 handbook, full pagewidth TDA9859H mhb918 1 2 3 4 5 6 7 8 9 10 11 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 n.c. ain l c ps2 scout l mad n.c. mout l lin l c bl1 c bl2 n.c. n.c. min r v p scout r agnd dgnd mout r lin r c br1 c br2 n.c. n.c. c ps1 ain r p2 scin r n.c. scin l p1 min l c smo n.c. n.c. n.c. c tl lout l sda n.c. scl lout r c tr n.c. n.c. fig.3 pin configuration TDA9859H qfp44 version.
2001 jul 11 7 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 functional description the tda9859 consists of the following functions: source select switching block loudspeaker channel with effect controls two port outputs for general purpose i 2 c-bus control. source select switching block the tda9859 selects and switches the input signals from three stereo or six mono sources main, aux and scart (see fig.1) to the outputs scart and loudspeaker (crossbar-switching; table 4). the main channel (line outputs) is looped outside the circuit (from pins mout r and mout l to pins lin r and lin l ), so signals can be used as line output or a surround sound decoder can be inserted. effect controls linear stereo, stereo with spatial effect (30% or 52% anti-phase crosstalk) and forced mono with or without pseudo-stereo effect are controlled by three bits. a muting of 85 db is provided. loudspeaker channel volume control is divided into volume control common and volume control left/right. the common part ( - 40 to +15 db) controls the left and right channels simultaneously; the left/right part ( - 23 to 0 db) controls the volume of left and right channels independently. treble control provides a control range from - 12 to +12 db and bass control from - 12 to +15 db. extended bass control can be provided by an external t-network (see fig.1) from - 15 to +19 db (in 2 db steps). i 2 c-bus control all control settings are stored in subaddress registers. data transmission is simplified by auto-incrementing the subaddresses. the on-chip power-on reset sets the mute bit to active, so both the scart and the loudspeaker outputs are muted. the muting can be switched off by writing a 0 (non-muted) into the mute control bits. limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. equivalent to discharging a 200 pf capacitor through a 0 w series resistor (machine model). 2. equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor (human body model). symbol parameter conditions min. max. unit v p supply voltage (pin v p ) - 010v v n voltage on all pins, ground excluded - 0v p v i o output current at lout and scout pins -- 2.5 ma at port output pins -- 1.5 ma p tot total power dissipation -- 850 mw t amb ambient temperature - 070 c t stg storage temperature -- 25 +150 c v es electrostatic handling voltage all pins; note 1 - 300 v all pins; note 2 - 2000 v
2001 jul 11 8 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 thermal characteristics characteristics v p =8v; t amb =25 c; treble and bass in linear positions (0 db); volume control left/right 0 db; spatial function, pseudo-stereo function and forced-mono function in off position and measurements taken in fig.1; unless otherwise speci?ed. symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air tda9859 (sdip32) 60 k/w TDA9859H (qfp44) 65 k/w symbol parameter conditions min. typ. max. unit v p supply voltage (pin v p ) 7.2 8.0 8.8 v i p supply current (pin v p ) - 25 - ma v ref internal reference voltage - 0.5v p - v v smo voltage at pin c smo - v p - 0.1 - v dc voltage on pins v i dc input voltage at pins scin, min, lin and ain - 0.5v p - v v o dc output voltage at pins scout, mout and lout - 0.5v p - v v c dc voltage on capacitors (pins c br1 , c br2 , c tr , c tl , c bl2 , c bl1 , c ps2 and c ps1 ) - 0.5v p - v audio select switch; line and scart outputs (controlled via i 2 c-bus); see table 4 v i(rms) maximum af input signal on pins scin, min and ain (rms value) thd 0.5% on output pins 2 -- v r i input resistance at pins scin, min and ain 20 30 40 k w b - 0.5 db - 0.5 db bandwidth for pins scout, mout and lout 20 - 20 000 hz v o(rms) maximum af output signal on pins scout and mout (rms value) thd 0.5% 2 -- v r l allowed external load resistance on output pins mout 10 -- k w on output pins scout 5 -- k w g v voltage gain from any input to scart and main outputs - 0 - db a cr switch crosstalk on outputs between af inputs f = 10 khz; unused inputs connected to ground - 90 - db
2001 jul 11 9 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 volume control common (f = 1 khz, 55 steps) v i(rms) maximum input signal on pins lin (rms value) g v = 0; thd 0.5% on output pins lout 2 -- v r i input resistance on pins lin 7.5 10 - k w g v volume control common voltage gain nominal - 40 - +15 db minimum - 38 - +14 db d g v volume control common voltage gain step width g v = - 32 to +15 db 0.5 1.0 1.5 db g v = - 40 to - 33 db 0.25 1.0 1.75 db volume control common voltage gain set error g v = - 32 to +15 db -- 1db g v = - 40 to - 33 db -- 2db volume control left/right (f = 1 khz, 24 steps) g v volume control left/right voltage gain nominal - 24 - 0db minimum - 23 -- 1db mute position - 80 - 85 - db d g v volume control left/right voltage gain step width 0.5 1.0 1.5 db volume control left/right voltage gain tracking error -- 2db bass control g v bass control voltage gain c b = 33 nf; f = 40 hz maximum boost 14 15 16 db maximum attenuation 11 12 13 db d g v bass control voltage gain step width 1 1.5 2 db g v(extended) extended bass control voltage gain see fig.1; f = 60 hz maximum boost 18 19 20 db maximum attenuation 14 15 16 db d g v(extended) extended bass control voltage gain step width 123db treble control g v treble control voltage gain f = 15 khz maximum boost 11 12 13 db maximum attenuation 11 12 13 db d g v treble control voltage gain step width 2.5 3 3.5 db effect controls a ct(spat1) anti-phase crosstalk by spatial effect 1 - 52 - % a ct(spat2) anti-phase crosstalk by spatial effect 2 - 30 - % j phase shift by pseudo-stereo see fig.4 symbol parameter conditions min. typ. max. unit
2001 jul 11 10 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 loudspeaker channel outputs (pins lout r and lout l ) v o(max)(rms) maximum output signal (rms value) thd 0.5%; r l >10k w ; c l < 1.5 nf 2 -- v d v dc(max) maximum dc offset voltage between adjoining step and any step to mute for volume control g v = 0 to +15 db/mute - 215mv g v = - 64 to 0 db/mute - 0.5 10 mv for bass control g v = 0 to +15 db/mute - 215mv g v = - 12 to 0 db/mute - 0.5 10 mv for treble control g v = - 12 to +12 db/mute - 0.5 10 mv r o output resistance -- 100 w r o(l) allowed output load resistor 10 -- k w c o(l) allowed output load capacitor -- 1.5 nf v no(w) weighted noise voltage at output (quasi-peak level) ccir 468-3 weighted g v = +15 db - 102 -m v g v =0db - 32 -m v g v = - 40 db - 27 -m v g v = - 80 db (mute) - 20 -m v b - 1db - 1 db bandwidth for loudspeaker channel 20 - 20000 hz thd total harmonic distortion f = 20 to 12500 hz for v i(rms) = 0.2 v g v = - 30 to +15 db - 0.1 0.3 % for v i(rms) =1v g v = - 30 to 0 db - 0.1 0.3 % for v i(rms) =2v g v = - 30 to - 6db - 0.1 0.3 % a cs(l-r) stereo channel separation f = 10 khz; g v = 0 db; opposite input grounded by 1 k w resistor - 75 - db a ct(bus) crosstalk from i 2 c-bus to af outputs (v bus = spurious i 2 c-bus signal voltage on af output) g v =0db - 100 - db psrr 100 power supply ripple rejection with 100 hz ripple g v = 0 db; v ripple(rms) < 200 mv - 55 - db scart output (pins scout r and scout l ) v o(max)(rms) maximum output signal (rms value) thd 0.5%; r l >5k w 2 -- v r o(l) output load resistor 5 -- k w power-on reset v ponr increasing supply voltage start of reset -- 2.5 v end of reset 5.2 6.0 6.8 v decreasing supply voltage start of reset 4.4 5.2 6.0 v symbol parameter conditions min. typ. max. unit a bus 20 log v bus(p-p) v o(rms) -------------------- - =
2001 jul 11 11 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 i 2 c-bus (pins scl and sda) v ih high-level input voltage 3 - v p v v il low-level input voltage 0 - 1.5 v i i input current -- 10 m a v ack output voltage with acknowledge at pin sda i sda = - 3ma -- 0.4 v module address (pin mad) v il low-level input voltage 0 - 1.5 v v ih high-level input voltage 3 - v p v port outputs (open-collector outputs pins p1 and p2) v ol low-level output voltage i o(sink) =1ma -- 0.3 v i o(sink) port output sink current -- 1ma symbol parameter conditions min. typ. max. unit
2001 jul 11 12 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 i 2 c-bus protocol this circuit operates as a slave receiver only. for more information about the i 2 c-bus, see the i 2 c-bus and how to use it , order number 9398 393 40011. i 2 c-bus format note 1. multiple data-a (acknowledge) sequences may occur. table 1 explanation of i 2 c-bus format note 1. if more than 1 byte of data is transmitted, then auto-increment of the subaddress is performed by the device. table 2 i 2 c-bus transmission note 1. if auto-increment of the subaddress is used, it is necessary to insert three dummy data words between the treble control byte and the switching control bytes. s slave address w a subaddress a data (1) a (1) p name description s start condition (scl high, sda high-to-low) slave address 100 0000 (mad = low) or 100 0001 (mad = high) w0 a acknowledge (sda = low); generated by the device subaddress subaddress (byte); see table 2 data (1) data byte; see table 2 p stop condition (scl = high, sda = low-to-high) function subaddress data bits binary hex d7 d6 d5 d4 d3 d2 d1 d0 loudspeaker channel volume control common 0000 0000 00 0 0 v05 v04 v03 v02 v01 v00 volume control left 0000 0001 01 0 0 0 vl4 vl3 vl2 vl1 vl0 volume control right 0000 0010 02 0 0 0 vr4 vr3 vr2 vr1 vr0 bass control 0000 0011 03 0 0 0 ba4 ba3 ba2 ba1 ba0 treble control 0000 0100 04 0 0 0 0 tr3 tr2 tr1 tr0 switching control byte scart output (1) 0000 1000 08 0 mu1 p1 p2 i13 i12 i11 i10 loudspeaker output 0000 1001 09 ef2 mu2 ef1 st i23 i22 i21 i20
2001 jul 11 13 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 table 3 function of the bits in table 2 table 4 input selection note 1. byte 8 (scart channels): the value of x depends on mu1 and control bits p1 and p2. byte 9 (loudspeaker channels): see table 5 for the programming of these bits. the value of x depends on the selected effects and mu2. bits function v00 to v05 volume control common for loudspeaker channel; see table 9 vl0 to vl4 volume control for left loudspeaker channel; see table 6 vr0 to vr4 volume control for right loudspeaker channel; see table 6 ba0 to ba4 bass control for left and right loudspeaker channels; see table 7 tr0 to tr3 treble control for left and right loudspeaker channels; see table 8 i10 to i13 input selection for scart channels; see table 4 i20 to i23 input selection for loudspeaker channels; see table 4 mu1 and mu2 mute control bits (mu1 for scart channel, mu2 for loudspeaker channel) 0 = channel not muted 1 = channel muted ef1, ef2 and st effect control bits for loudspeaker channel; see table 5 p1 and p2 control bits for ports p1 and p2 control bit = 0: port output = low-level control bit = 1: port output = high-level input bits of data byte 8 and 9 hex d7 d6 d5 d4 d3 d2 d1 d0 aux left xb (1) (1) mu (1) (1) 1011 aux right x9 (1) (1) mu (1) (1) 1001 aux stereo x7 (1) (1) mu (1) (1) 0111 scart left xa (1) (1) mu (1) (1) 1010 scart right x5 (1) (1) mu (1) (1) 0101 scart stereo x6 (1) (1) mu (1) (1) 0110 main left xc (1) (1) mu (1) (1) 1100 main right xd (1) (1) mu (1) (1) 1101 main stereo x8 (1) (1) mu (1) (1) 1000
2001 jul 11 14 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 table 5 effect controls note 1. the value of x depends on the selected input (see table 4). setting special effects data byte to subaddress 09 hex ef2 mu2 ef1 st i23 i22 i21 i20 stereo with spatial effect 1 (52%) bx (1) 1011 (1) (1) (1) (1) stereo with spatial effect 2 (30%) 3x (1) 0011 (1) (1) (1) (1) stereo without spatial effect 1x (1) 0001 (1) (1) (1) (1) forced mono with pseudo stereo 2x (1) 0010 (1) (1) (1) (1) forced mono without pseudo stereo 0x (1) 0000 (1) (1) (1) (1) table 6 volume control left/right table 7 bass control g v (db) data bits hex vl4 vl3 vl2 vl1 vl0 vr4 vr3 vr2 vr1 vr0 01f1 1 1 1 1 - 11e 1 1 1 1 0 - 21d 1 1 1 0 1 - 31c 1 1 1 0 0 - 41b 1 1 0 1 1 - 51a 1 1 0 1 0 - 619 1 1 0 0 1 - 718 1 1 0 0 0 - 817 1 0 1 1 1 - 916 1 0 1 1 0 - 10 15 1 0 1 0 1 - 11 14 1 0 1 0 0 - 12 13 1 0 0 1 1 - 13 12 1 0 0 1 0 - 14 11 1 0 0 0 1 - 15 10 1 0 0 0 0 - 16 0f 0 1 1 1 1 - 17 0e 0 1 1 1 0 - 18 0d 0 1 1 0 1 - 19 0c 0 1 1 0 0 - 20 0b 0 1 0 1 1 - 21 0a 0 1 0 1 0 - 22 09 0 1 0 0 1 - 23 08 0 1 0 0 0 mute 07 0 0 1 1 1 g v (db) data bits hex ba4 ba3 ba2 ba1 ba0 +15 19 1 1 0 0 1 +13.5 18 1 1 0 0 0 +12 17 1 0 1 1 1 +10.5 16 1 0 1 1 0 +9 15 1 0 1 0 1 +7.5 14 1 0 1 0 0 +6 13 1 0 0 1 1 +4.5 12 1 0 0 1 0 +3 11 1 0 0 0 1 +1.5 10 1 0 0 0 0 00f0 1 1 1 1 00e0 1 1 1 0 - 1.5 0d 0 1 1 0 1 - 30c 0 1 1 0 0 - 4.5 0b 0 1 0 1 1 - 60a 0 1 0 1 0 - 7.5 09 0 1 0 0 1 - 908 0 1 0 0 0 - 10.5 07 0 0 1 1 1 - 12 06 0 0 1 1 0
2001 jul 11 15 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 table 8 treble control table 9 volume control common g v (db) data bits hex 0 tr3 tr2 tr1 tr0 +12 0a 0 1 0 1 0 +9 09 0 1 0 0 1 +6 08 0 1 0 0 0 +3 07 0 0 1 1 1 0060 0 1 1 0 - 305 0 0 1 0 1 - 604 0 0 1 0 0 - 903 0 0 0 1 1 - 12 02 0 0 0 1 0 g v (db) data bits hex v05 v04 v03 v02 v01 v00 +153f111111 +143e111110 +133d111101 +123c111100 +113b111011 +103a111010 +939111001 +838111000 +737110111 +636110110 +535110101 +434110100 +333110011 +232110010 +131110001 030110000 - 12f101111 - 22e101110 - 32d101101 - 42c101100 - 52b101011 - 62a101010 - 729101001 - 828101000 - 927100111 - 1026100110 - 1125100101 - 1224100100 - 1323100011 - 1422100010 - 1521100001 - 1620100000 - 171f011111 - 181e011110 - 191d011101 - 201c011100 - 211b011011 - 221a011010 - 2319011001 - 2418011000 - 2517010111 - 2616010110 - 2715010101 - 2814010100 - 2913010011 - 3012010010 - 3111010001 - 3210010000 - 330f001111 - 340e001110 - 350d001101 - 360c001100 - 370b001011 - 380a001010 - 3909001001 - 4008001000 g v (db) data bits hex v05 v04 v03 v02 v01 v00
2001 jul 11 16 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 handbook, full pagewidth - 400 0 (1) (2) (3) phase (degree) - 300 - 200 - 100 mha311 10 2 10 3 10 4 f (hz) 10 5 10 fig.4 pseudo stereo effect (phase) as a function of frequency. (1) normal effect; c ps1 =c ps2 =15nf. (2) intensified effect; c ps1 = 47 nf; c ps2 = 5.6 nf. (3) more intensified effect; c ps1 = 68 nf; c ps2 = 5.6 nf.
2001 jul 11 17 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 package outlines unit b 1 cee m h l references outline version european projection issue date iec jedec eiaj mm dimensions (mm are the original dimensions) sot232-1 92-11-17 95-02-04 b max. w m e e 1 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 3.2 2.8 0.18 1.778 10.16 10.7 10.2 12.2 10.5 1.6 4.7 0.51 3.8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 32 1 17 16 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) d (1) z a max. 12 a min. a max. sdip32: plastic shrink dual in-line package; 32 leads (400 mil) sot232-1
2001 jul 11 18 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 unit a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 0.8 1.3 12.9 12.3 1.2 0.8 10 0 o o 0.15 0.1 0.15 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.95 0.55 sot307-2 95-02-04 97-08-01 d (1) (1) (1) 10.1 9.9 h d 12.9 12.3 e z 1.2 0.8 d e e b 11 c e h d z d a z e e v m a x 1 44 34 33 23 22 12 y q a 1 a l p detail x l (a ) 3 a 2 pin 1 index d h v m b b p b p w m w m 0 2.5 5 mm scale qfp44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm sot307-2 a max. 2.10
2001 jul 11 19 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2001 jul 11 20 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, hbga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable -
2001 jul 11 21 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective speci?cation development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary speci?cation quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product speci?cation production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2001 jul 11 22 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 purchase of philips i 2 c components purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.
2001 jul 11 23 philips semiconductors product speci?cation universal hi-? audio processor for tv tda9859 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2001 72 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, marketing communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 7 - 9 rue du mont valrien, bp317, 92156 suresnes cedex, tel. +33 1 4728 6600, fax. +33 1 4728 6638 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: philips hungary ltd., h-1119 budapest, fehervari ut 84/a, tel: +36 1 382 1700, fax: +36 1 382 1800 india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 5f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2451, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 60/14 moo 11, bangna trad road km. 3, bagna, bangkok 10260, tel. +66 2 361 7910, fax. +66 2 398 3447 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753504/03/pp 24 date of release: 2001 jul 11 document order number: 9397 750 08551

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